Thermal and RF Systems Engineer - Qualcomm Technologies, Inc. (Monterey Park)
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Overview Qualcomm-Atheros, a.k.a. QCA is a wholly owned subsidiary of Qualcomm and a leading provider of wireless and wired technologies for the mobile, networking, computing and consumer electronics markets. We are focused on inventing technologies that connect and empower people in ways that are elegant and accessible to all. The Thermal Engineer will work as part of the Hardware Systems team to bring new chips and reference designs to market. The thermal engineer will provide thermal simulations to the extended team to estimate die temperature for different operating modes, for WLAN SOCs, PAs, Front End Modules as well as other components which are on the reference design. The thermal engineers simulations will be used to guide the SOC and package design, as well as module designs early in the program. Individual must be able to recommend changes to the package of printed circuit board design to overcome thermal issues which are identified during simulations. The thermal engineer will also be responsible to verify the thermal performance of the actual part once Silicon and Hardware become available later in the program. Must be able to configure and operate the Mobile test platform in different modes and measure the temperature of key components, calculate R-factors, compare the accuracy of on die thermistors with calibrated instruments etc All Qualcomm employees are expected to actively support diversity on their teams, and in the Company. Minimum Qualifications
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.
5+ years Hardware Engineering experience or related work experience.
Proficient in Thermal Engineering and Heat Transfer Analysis for Semiconductor products and Printed Circuit Boards with at least 5 years hands on experience.
Proficient at performing full 3D Thermal Simulations using tools such as FloTHERM from Mentor Graphics or Icepak from ANSYS.
Ability to independently create a model in either tool, from basic die and package information.
Ability to properly estimate the power dissipation for each area of the chip or PCB based on discussions with the circuit designers and other members of the hardware systems team, and use this data to refine and optimize the thermal simulation.
Experience in Mechanical Design, RF System Design, knowledge of electromagnetics, chip packaging, transceiver design as well as 802.11 standards and devices is a plus
Self-driven individual who can plan/coordinate with teams globally and execute projects independently.